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K11P121M50SF4 Datasheet, PDF (29/59 Pages) Freescale Semiconductor, Inc – K11 Sub-Family Data Sheet
Peripheral operating requirements and behaviors
6.3.3.2 32kHz oscillator frequency specifications
Table 18. 32kHz oscillator frequency specifications
Symbol Description
fosc_lo
tstart
fec_extal32
vec_extal32
Oscillator crystal
Crystal start-up time
Externally provided input clock frequency
Externally provided input clock amplitude
Min.
Typ.
Max.
Unit
—
32.768
—
kHz
—
1000
—
ms
—
32.768
—
kHz
700
—
VBAT
mV
Notes
1
2
2, 3
1. Proper PC board layout procedures must be followed to achieve specifications.
2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The
oscillator remains enabled and XTAL32 must be left unconnected.
3. The parameter specified is a peak-to-peak value and VIH and VIL specifications do not apply. The voltage of the applied
clock must be within the range of VSS to VBAT.
6.4 Memories and memory interfaces
6.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 19. NVM program/erase timing specifications
Symbol Description
thvpgm4 Longword Program high-voltage time
thversscr Sector Erase high-voltage time
thversblk256k Erase Block high-voltage time for 256 KB
Min.
—
—
—
Typ.
7.5
13
104
Max.
18
113
904
Unit
Notes
μs
ms
1
ms
1
1. Maximum time based on expectations at cycling end-of-life.
K11 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
Freescale Semiconductor, Inc.
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