K11P121M50SF4 Datasheet, PDF (20/59 Pages) Freescale Semiconductor, Inc – K11 Sub-Family Data Sheet

General
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p)
R_θJA
Single-layer (1s)
R_θJMA
Four-layer (2s2p)
R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
Thermal resistance,
junction to ambient
(natural convection)
Thermal resistance,
junction to ambient
(natural convection)
Thermal resistance,
junction to ambient
(200 ft./min. air speed)
Thermal resistance,
junction to ambient
(200 ft./min. air speed)
Thermal resistance,
junction to board
Thermal resistance,
junction to case
Thermal
characterization
parameter, junction to
package top outside
center (natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1,3
1,3
4
5
6
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
3.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
4.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
K11 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
20
Freescale Semiconductor, Inc.