MC68181 Datasheet, PDF (21/119 Pages) Freescale Semiconductor, Inc – Advance Information ROAMING FLEX chip SIGNAL PROCESSOR

Freescale Semiconductor, Inc.
MC68181
Pin-out and Package Information
A
A1
32
4X
25
0.20
AB T-U Z
1
-T-
-U-
B
B1
8
DETAIL Y
V
17 ^V1
9
-Z-
4X
9
S1
0.20 AC T-U Z
S
-AB-
SEATING
PLANE
-AC-
G
0.10 AC
8X M °
R
CE
DETAIL AD
BASE
METAL
N
F
D
J
SECTION AE-AE
W
H
K ^Q°
X
DETAIL AD
AE
P
AE
DETAIL Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUMPLANE-AB-ISLOCATEDATBOTTOMOFLEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT
DATUM PLANE -AB-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -AC-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
(0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -AB-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.520.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER MAY VARY FROM
DEPICTION.
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.300 0.450
E 1.350 1.450
F 0.300 0.400
G 0.800 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M
12° REF
N 0.090 0.160
P 0.400 BSC
Q 1°
5°
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
X
1.000 REF
CASE 873A-02
ISSUE A
DATE 12/16/93
Figure 3-3 32-pin Thin Quad Flat Pack (TQFP) Mechanical Information
MOTOROLA
MC68181 Technical Data Sheet
3-5
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