MC68181 Datasheet, PDF (1/119 Pages) Freescale Semiconductor, Inc – Advance Information ROAMING FLEX chip SIGNAL PROCESSOR

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SEMICONDUCTOR TECHNICAL DATA
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MC68181 Technical Data
Advance Information
ROAMING FLEX™ chip SIGNAL PROCESSOR
MC68181
The FLEX™ protocol is a multi-speed, high-performance protocol adopted by leading service
providers worldwide as a de facto paging standard. The FLEX protocol gives service providers
the increased capacity, added reliability, and enhanced pager battery performance they need
today. It also provides an upward migration path to the service provider that is completely
transparent to the end user.
The MC68181 Roaming FLEX™ chip IC is part of a total solution available from Motorola for
providing FLEX capabilities in a low-power, low-cost system. The FLEX™ chip simplifies
implementation of a FLEX paging device by interfacing with any of several off-the-shelf paging
receivers, and any of several off-the-shelf host microcontroller/microprocessors. The primary
function of the FLEX™ chip is to process information received and demodulated from a FLEX-
radio paging channel, select messages addressed to the paging device, and communicate the
message information to the host. The host controls receiver channel selection, and interprets the
message information in an appropriate manner (numeric, alphanumeric, binary, etc.) and
handles all the I/O activity. The FLEX™ chip IC also operates the paging receiver in an efficient
power consumption mode and enables the host to operate in a low power mode when
monitoring a single channel for message information. Figure 1 shows the MC68181 functional
block diagram.
EXTS0
EXTS1
SYMCLK
Symbol Sync
XTAL
EXTAL
OSCPD
Sync Correlator
76.8 kHz
Oscillator _{De-Interleaver}
Noise Detector
2 ^Vdd
2 ^Vss
Internal Control
Unit
External
Control
Unit
RESET
LOBAT
Error
Corrector
Control/Status
Registers
CLKOUT
Clock
Address
Comparator
Local Message
Filter
8
S0–S7
Receiver
Control
SPI Buffer
SPI
Figure 1 MC68181 Functional Block Diagram
READY
4
SPI
AA0813
This document contains information on a new product. Specifications and information herein are subject to change without notice.
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