MC68181 Datasheet, PDF (10/119 Pages) Freescale Semiconductor, Inc – Advance Information ROAMING FLEX chip SIGNAL PROCESSOR

MC68181
Thermal characteristics
Freescale Semiconductor, Inc.
Table 2-1 Maximum Ratings
Rating
Supply Voltage
All input voltages
Current drain per pin excluding V_DD and V_SS
Operating temperature range
Storage temperature
Symbol
V_DD
V_IN
I
T_A
T_STG
Min
−0.5
−0.5
—
–30
–65
Max
6
6.5
10
+85
+150
Unit
V
V
mA
˚C
˚C
THERMAL CHARACTERISTICS
Table 2-2 Thermal Characteristics
Characteristic
Symbol TQFP Value Unit
Junction-to-ambient thermal resistance¹
Thermal characterization parameter
R_θJA or θ_JA
Ψ_JT
95
˚C/W
21
˚C/W
Note:
1. Junction-to-ambient thermal resistance is based on measurements on a horizontal, single-sided
Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment and
Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, [phone]) Values
were measured with the parts mounted on thermal test boards meeting the specification EIA/
JESD51-3.
2-2
MC68181 Technical Data Sheet
MOTOROLA
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