K20P81M100SF2_1109 Datasheet, PDF (21/75 Pages) Freescale Semiconductor, Inc – K20 Sub-Family Data Sheet

5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
–40
–40
Max.
125
105
General
Unit
°C
°C
5.4.2 Thermal attributes
Board type
Single-layer
(1s)
Symbol
R_θJA
Four-layer
(2s2p)
R_θJA
Single-layer
(1s)
R_θJMA
Four-layer
(2s2p)
R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description 81 MAPBGA
Thermal
65
resistance,
junction to
ambient (natural
convection)
Thermal
36
resistance,
junction to
ambient (natural
convection)
Thermal
52
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
31
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
17
resistance,
junction to
board
Thermal
13
resistance,
junction to case
Thermal
3
characterization
parameter,
junction to
package top
outside center
(natural
convection)
80 LQFP
50
35
39
29
19
8
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1
1
1
1
2
3
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Freescale Semiconductor, Inc.
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