LUPA-4000_07 Datasheet, PDF (33/38 Pages) Cypress Semiconductor – 4M Pixel CMOS Image Sensor

Bonding diagram
The die is bonded to the bonding pads of the package as
indicated below
Figure 26. Bonding pads diagram of the LUPA-4000 package.
LUPA-4000
The die will be placed in the package in a way that the center
of the light sensitive area will match the center of the package.
Document Number: 38-05712 Rev. *B
Page 33 of 38