LUPA-4000_07 Datasheet, PDF (3/38 Pages) Cypress Semiconductor – 4M Pixel CMOS Image Sensor

LUPA-4000
Synchronous shutter operation ........................................................................................................................... 11
Principle of non-destructive readout. .................................................................................................................. 12
Internal timing of the pixel................................................................................................................................... 14
Integration and read out in parallel ..................................................................................................................... 16
Integration and readout sequentially .................................................................................................................. 16
Timing of the pixel array ...................................................................................................................................... 17
Readout of the image sensor. F.O.T ................................................................................................................... 18
X- and Y-addressing ........................................................................................................................................... 19
X-addressing. From bottom to top ....................................................................................................................... 20
Output signal related to Clock_x signal ............................................................................................................... 21
Standard timing for the R.O.T. Only pre_col and Norowsel control signals are required .................................... 22
Reduced standard ROT by means of Sh_col signal............................................................................................ 22
X- and Y-addressing with precharging of the buses ........................................................................................... 23
SPI block diagram and timing ............................................................................................................................. 24
Die figure of the LUPA-4000 ............................................................................................................................... 29
Package drawing of the LUPA-4000 package .................................................................................................... 30
LUPA-4000 package specifications with die ....................................................................................................... 31
Placing of the bonding pads on the LUPA-4000 package .................................................................................. 32
Bonding pads diagram of the LUPA-4000 package ........................................................................................... 33
Transmission characteristics of the D263 glass used as protective cover for the LUPA-4000 sensors. ............ 34
Content of the LUPA-4000 evaluation kit ........................................................................................................... 36
Dual slope diagram ............................................................................................................................................. 37
LIST OF TABLES
General specifications ........................................................................................................................................ 4
Electro-optical specifications .............................................................................................................................. 4
Features and general specifications ................................................................................................................... 6
Recommended operation conditions .................................................................................................................. 7
Frame rate as function of ROI read out and/or sub sampling ............................................................................. 9
ADC specifications ............................................................................................................................................. 10
Advantages and disadvantages of non-destructive readout. .............................................................................. 12
Power supplies ................................................................................................................................................... 12
Overview of the power supplies related to the pixel signals ............................................................................... 13
Overview of bias signals ..................................................................................................................................... 13
Overview of the in- and external pixel array signals ........................................................................................... 15
Timing specifications .......................................................................................................................................... 17
Read-out timing specifications ............................................................................................................................ 19
Read-out timing specifications with precharching of the buses .......................................................................... 23
SPI parameters ................................................................................................................................................... 24
Document Number: 38-05712 Rev. *B
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