IBIS4-14000-M Datasheet, PDF (27/30 Pages) Cypress Semiconductor – 14-Megapixel CMOS Image Sensor

IBIS4-14000-M
IBIS4-14000-C
Defects (digs, scratches) detected at final test using F/11 light
source. Glass defects that do not generate non-correctable
pixels are accepted.
5.0 Storage and Handling
5.1 Storage Conditions
Description Minimum Maximum Unit
Temperature –10
66
°C
Temperature –10
38
°C
Note: RH = Relative Humidity
Conditions
@ 15% RH
@ 86% RH
5.2 Handling Precautions
Special care should be taken when soldering image sensors
with color filter arrays (RGB color filters), onto a circuit board,
since color filters are sensitive to high temperatures.
Prolonged heating at elevated temperatures may result in
deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor perfor-
mance is not compromised during end-users’ assembly
processes.
5.3 ESD
Though not as sensitive as CCD sensors, the IBIS4-14000 is
vulnerable to ESD like other standard CMOS devices. Device
placement onto boards should be done in accordance with
strict ESD controls for Class 0, JESD22 Human Body Model,
and Class A, JESD22 Machine Model devices. Take into
account standard ESD procedures when manipulating the
device:
• Assembly operators should always wear all designated and
approved grounding equipment; grounded wrist straps at
ESD protected workstations are recommended including
the use of ionized blowers. All tools should be ESD
protected. To ground the human body, provide a resistance
of 1 MOhm between the human body and the ground to be
on the safe side.
• When directly handling the device with the fingers, hold the
part without the leads and do not touch any lead.
• To avoid generating static electricity:
— Do not scrub the glass surface with cloth or plastic
— Do not attach any tape or labels
— Do not clean the glass surface with dust-cleaning tape
• When storing or transporting the device, put it in a container
of conductive material
5.4 Dust and Contamination
Dust or contamination of the glass surface could deteriorate
the output characteristics or cause a scar. In order to
minimize dust or contamination on the glass surface, take the
following precautions:
• Handle the device in a clean environment such as a cleaned
booth (the cleanliness should be, if possible, class 100).
• Do not touch the glass surface with the fingers.
• Use gloves to manipulate the device
5.5 Soldering
Soldering should be manually performed with 5 seconds at
350°C maximum at the tip of the soldering iron.
5.6 Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be adversely
affected by the flux. Avoid mechanical or particulate damage
to the cover glass. Avoid mechanical stress when mounting
the device.
5.7 RoHS (lead-free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 14. Chemical Substances and Information about Any Intentional Content
Chemical Substance
Lead
Cadmium
Mercury
Hexavalent chromium
PBB (Polybrominated biphenyls)
PBDE (Polybrominated diphenyl ethers)
Any intentional
content?
NO
NO
NO
NO
NO
NO
If there is any intentional content,
in which portion is it contained?
-
-
-
-
-
-
Document #: 38-05709 Rev. *A
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