IBIS4-14000-M Datasheet, PDF (22/30 Pages) Cypress Semiconductor – 14-Megapixel CMOS Image Sensor

4.0 Geometry & Mechanical
4.1 Die Geometry
IBIS4-14000-M
IBIS4-14000-C
Pin 1
4 output
channels
pixel 0,0
500 µm
Ground pad, also connected to
package ground plane
Analog output pad
Ground for output pad (not connected
to package ground plane)
Locations of temperature sensing
diodes
Location of photodiode array
Figure 16. Die Geometry and Location of Pixel (0,0)
Document #: 38-05709 Rev. *A
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