IBIS4-14000-M Datasheet, PDF (2/30 Pages) Cypress Semiconductor – 14-Megapixel CMOS Image Sensor

IBIS4-14000-M
IBIS4-14000-C
Table of Contents
1.0 SPECIFICATIONS ............................................................................................................................................ 4
1.1 General Specifications ................................................................................................................................................... 4
1.2 Electro-optical Specifications ......................................................................................................................................... 4
1.2.1 Overview ............................................................................................................................................................. 4
1.2.2 Spectral Response Curve ................................................................................................................................... 5
1.2.3 Electro-voltaic Response Curve .......................................................................................................................... 5
1.3 Electrical Specifications ................................................................................................................................................. 6
1.3.1 Absolute Maximum Ratings ................................................................................................................................. 6
1.3.2 Recommended Operating Specifications ............................................................................................................ 6
1.3.3 Bias Currents and References ............................................................................................................................ 6
2.0 ARCHITECTURE AND OPERATION ............................................................................................................... 7
2.1 Floor Plan ...................................................................................................................................................................... 7
2.2 Pixel specifications ........................................................................................................................................................ 8
2.2.1 Architecture ......................................................................................................................................................... 8
2.2.2 FPN and PRNU ................................................................................................................................................... 9
2.2.3 Color Filter Array (CFA) ....................................................................................................................................... 9
2.2.4 Output Stage ....................................................................................................................................................... 9
2.2.5 Output Amplifier Crossbar Switch (multiplexer) ................................................................................................. 10
2.3 Readout and Subsampling Modes .............................................................................................................................. 11
2.4 Sensor Readout Timing Diagrams ............................................................................................................................... 14
2.4.1 Row Sequencer ................................................................................................................................................. 14
2.4.2 Timing Pulse Pattern for Readout of a Pixel ...................................................................................................... 16
2.4.3 Fast Frame Reset Timing Diagram .................................................................................................................. 16
2.5 SPI Register ............................................................................................................................................................... 18
2.5.1 SPI Interface Architecture ................................................................................................................................. 18
2.5.2 SPI Register Definition ...................................................................................................................................... 18
3.0 PIN CONFIGURATION ................................................................................................................................... 20
4.0 GEOMETRY & MECHANICAL ...................................................................................................................... 22
4.1 Die Geometry .............................................................................................................................................................. 22
4.2 Pin Number Assignment .............................................................................................................................................. 23
4.3 Package Drawings ...................................................................................................................................................... 24
4.4 Die Placement Dimensions and Accuracy ................................................................................................................... 25
4.5 Cover Glass ................................................................................................................................................................. 26
4.5.1 IBIS4-14000-M (monochrome) .......................................................................................................................... 26
4.5.2 IBIS4-14000-C (color) ....................................................................................................................................... 26
5.0 STORAGE AND HANDLING .......................................................................................................................... 27
5.1 Storage Conditions ...................................................................................................................................................... 27
5.2 Handling Precautions .................................................................................................................................................. 27
5.3 ESD ............................................................................................................................................................................. 27
5.4 Dust and Contamination .............................................................................................................................................. 27
5.5 Soldering ..................................................................................................................................................................... 27
5.6 Precautions and Cleaning ........................................................................................................................................... 27
5.7 RoHS (lead-free) Compliance ...................................................................................................................................... 27
6.0 ORDERING INFORMATION .......................................................................................................................... 29
6.1 Part Numbers .............................................................................................................................................................. 29
6.2 Evaluation Kit ............................................................................................................................................................... 29
Document #: 38-05709 Rev. *A
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