CS35L32 Datasheet, PDF (50/51 Pages) Cirrus Logic – Boosted Class D Amplifier with Speaker-Protection Monitoring and Flash LED Drivers

10 Package Dimensions
X
A
A3
A2
X
A1
CS35L32
10 Package Dimensions
Ball A1
M
Location
Indicator
Ball A1 Location
Indicator
Y
N
Z
e
c
Y Seating plane
øb
b
Øddd Z X Y
e
d
WAFER BACK SIDE
SIDE VIEW
Øccc Z
BUMP SIDE
Notes:
• Dimensioning and tolerances per ASME Y 14.5M–1994.
• The Ball A1 position indicator is for illustration purposes only and may not be to scale.7
• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body and the seating plane
Datum Z.
• Dimension A3 describes the thickness of the backside film.
Table 10-1. WLCSP Package Dimensions
Dimension
Minimum
Millimeters
Nominal
Maximum
A
0.451
0.494
0.537
A1
0.169
0.194
0.219
A2
0.275
0.3
0.325
A3
0.022
0.025
0.028
M
BSC
2.000
BSC
N
BSC
1.600
BSC
b
0.243
0.268
0.293
c
REF
0.264
REF
d
REF
0.295
REF
e
BSC
0.400
BSC
X
2.560
2.590
2.620
Y
2.108
2.138
2.168
ccc = 0.10
ddd = 0.05
Note: Controlling dimension is millimeters.
Figure 10-1. 30-Ball WLCSP Package Drawing
11 Thermal Characteristics
Parameters
Junction-to-ambient thermal impedance
Table 11-1. Thermal Resistance
Symbol
Min
_JA
—
Typical
50
Max
Units
—
°C/Watt
50
DS963F5