W25Q64FV_13 Datasheet, PDF (9/89 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q64FV
3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Top View
Top View
A2
A3
A4
A5
NC
NC
NC
NC
B1
B2
B3
B4
B5
NC
CLK
GND
VCC
NC
C1
C2
C3
C4
C5
NC
/CS
NC /WP (IO2) NC
D1
D2
D3
D4
D5
NC
DO(IO1) DI(IO0) _/HOLD(IO3) NC
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
A1
A2
A3
A4
NC
NC
NC
NC
B1
B2
B3
B4
NC
CLK
GND
VCC
C1
C2
C3
C4
NC
/CS
NC /WP (IO2)
D1
D2
D3
D4
NC DO(IO1) DI(IO0) /HOLD(IO3)
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
Package Code TB
Package Code TC
Figure 1e. W25Q64FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB / TC)
3.8 Ball Description TFBGA 8x6-mm
BALL NO.
B2
B3
B4
C2
C4
D2
D3
D4
Multiple
PIN NAME
CLK
GND
VCC
/CS
/WP (IO2)
DO (IO1)
DI (IO0)
/HOLD (IO3)
NC
I/O
FUNCTION
I
Serial Clock Input
Ground
Power Supply
I
Chip Select Input
I/O
Write Protect Input (Data Input Output 2)*²
I/O
Data Output (Data Input Output 1)*¹
I/O
Data Input (Data Input Output 0)*¹
I/O
Hold Input (Data Input Output 3)*²
No Connect
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
Publication Release Date: October 07, 2013
-9-
Revision L