W25Q64FV_13 Datasheet, PDF (88/89 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q64FV
9. REVISION HISTORY
VERSION
DATE
A
03/29/2011
B
08/10/2011
C
11/02/2011
D
04/13/2012
E
07/13/2012
F
10/15/2012
G
03/15/2013
H
04/11/2013
I
04/25/2013
J
05/30/2013
K
06/10/2013
K1
09/10/2013
L
10/07/2013
PAGE
All
60-62
5-9, 81, 85-87
All
62
75
76
82
9, 79, 84, 86-87
10, 14, 72
87
72
80
87
76
86,87
76
17
71
81,82
5,10,88-90
89
89
59,60
74
76-77
5,17,76,86-87
DESCRIPTION
New Create Preliminary
Updated SFDP to JESD216
Added PDIP, TFBGA package types
Removed preliminary designator
Referred to SFDP definition application note
Updated clock high/low time for Read Data
Updated Erase Time
Updated WSON metal pad size
Added TFBGA 5x5, VSOP packages, Q order
option
Added power-down requirement
Updated PDIP part number
Updated power-up timing parameters
Updated PDIP dimensions
Updated ordering part number
Added tSE of W25Q64FVxxIF
Added W25Q64FVxxIF into order information
Moidfied tSE of W25Q64FVxxIQ & IF
Added Quad Enable default description
Modified Supply Voltage
Updated note for metal pad for WSON, USON
Added WLBGA package type
Added WLBGA “TOP SIDE MARKING”
Added WLBGA for W25Q64FVBYIQ
Modified the description of 92h and 94h
Modified DC Electrical Characteristics
Modified AC Electrical Characteristics
Removed the W25Q64FVxxIP & WLBGA package
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