W25Q64FV_13 Datasheet, PDF (85/89 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q64FV
8.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)
Note:
Ball land: 0.45mm. Ball Opening: 0.35mm
PCB ball land suggested <= 0.35mm
Symbol
A
A1
b
D
D1
E
E1
e
Min
---
0.25
0.35
7.95
5.95
Millimeters
Nom
---
0.30
0.40
8.00
5.00 BSC
6.00
3.00 BSC
1.00 BSC
Max
1.20
0.35
0.45
8.05
6.05
Min
---
0.010
0.014
0.313
0.234
Inches
Nom
---
0.012
0.016
0.315
0.197 BSC
0.236
0.118 BSC
0.039 BSC
Max
0.047
0.014
0.018
0.317
0.238
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Publication Release Date: October 07, 2013
Revision L