W25Q64FV_13 Datasheet, PDF (82/89 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

8.5 8-Pad WSON 8x6-mm (Package Code ZE)
W25Q64FV
Symbol
A
A1
b
C
D
D2
E
E2
e
L
y
Min
0.70
0.00
0.35
---
7.90
3.35
5.90
4.25
---
0.45
0.00
Millimeters
Nom
0.75
0.02
0.40
0.20 REF
8.00
3.40
6.00
4.30
1.27
0.50
---
Max
0.80
0.05
0.48
---
8.10
3.45
6.10
4.35
---
0.55
0.050
Min
0.028
0.000
0.014
---
0.311
0.132
0.232
0.167
---
0.018
0.000
Inches
Nom
0.030
0.001
0.016
0.008 REF
0.315
0.134
0.236
0.169
0.050
0.020
---
Max
0.031
0.002
0.019
---
0.319
0.136
0.240
0.171
---
0.022
0.002
Note:
The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be
left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad.
- 82 -