W25Q64FV_13 Datasheet, PDF (86/89 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

8.9 Ordering Information

W = Winbond
W25Q64FV
W⁽¹⁾ 25Q 64F V xx⁽²⁾
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
64F = 64M-bit
V = 2.7V to 3.6V
SS = 8-pin SOIC 208-mil ZP = 8-pad WSON 6x5mm
SF = 16-pin SOIC 300-mil ZE = 8-pad WSON 8x6mm
TC = 24-ball TFBGA 8x6mm (6x4 ball array)
TB = 24-ball TFBGA 8x6mm (5x5-1 ball array)
DA = 8-pin PDIP 300-mil
ST = 8-pin VSOP 208-mil
I = Industrial (-40°C to +85°C)
(3,4)
G=
F=
Q=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb₂O₃)
Green Package with Fast Sector Erase time (tSE)
Green Package with QE=1 in Status Register-2
Notes:
1. The “W” prefix is not included on the part marking.
2. Only the 2^nd letter is used for the part marking; WSON package type ZP and ZE are not used for the part marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel
(shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please contact Winbond.
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