W25Q64FV_13 Datasheet, PDF (84/89 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q64FV
8.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array)
Note:
Ball land: 0.45mm. Ball Opening: 0.35mm
PCB ball land suggested <= 0.35mm
Symbol
A
A1
A2
b
D
D1
E
E1
SE
SD
e
Min
---
0.25
---
0.35
7.90
5.90
Millimeters
Nom
---
0.30
0.85
0.40
8.00
4.00 BSC
6.00
4.00 BSC
1.00 TYP
1.00 TYP
1.00 BSC
Max
1.20
0.35
---
0.45
8.10
6.10
Min
---
0.010
---
0.014
0.311
0.232
Inches
Nom
---
0.012
0.033
0.016
0.315
0.157 BSC
0.236
0.157 BSC
0.039 TYP
0.039 TYP
0.039 BSC
Max
0.047
0.014
---
0.018
0.319
0.240
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