W77IE58 Datasheet, PDF (88/90 Pages) Winbond – 8-BIT MICROCONTROLLER

Preliminary W77IE58
Typical Application Circuits, continued
Expanded External Data Memory and Oscillator
V_CC
VCC
10 u ^OSCILLATOR
8.2 K
31
EA
19 _XTAL1
18 _XTAL2
9 _RST
12 ^INT0
13 _INT1
14 _T0
15 _T1
1
2
P1.0
P1.1
3
4
P1.2
P1.3
5 _P1.4
6 _P1.5
7 _P1.6
8 _P1.7
W77IE58
P0.0 39 AD0 AD0 3 _{D0 Q0} 2 A0 A0 10 _{A0 D0} 11 AD0
P0.1 38 AD1 AD1 4 _{D1 Q1} 5 A1 A1 9 A1
P0.2 37 AD2 AD2 7 _{D2 Q2} 6 A2 A2 8 _A2
P0.3 36 AD3 AD3 8 _{D3 Q3} 9 A3 A3 7 _A3
P0.4 ₃₅ AD4 _{AD4 13 D4 Q4} 12 A4 A4 6 _A4
P0.5 34 AD5 AD5 14 _{D5 Q5} 15 A5 A5 5 _A5
D1 ^{12 AD1}
D2 13 AD2
D3 ^{15 AD3}
D4 ^{16 AD4}
D5 17 AD5
P0.6 33 AD6 AD6 17 _{D6 Q6} 16 A6 A6 4 A6
P0.7 32 AD7 AD7 18 _{D7 Q7} 19 A7 A7 3 _A7
P2.0 21 A8
GND 1 _OC
A8 25 _A8
A9 24 A9
D6 ^{18 AD6}
D7 19 AD7
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
22 A9
23 A10
24 A11
25 A12
26 A13
27 A14
28
11 _G
74373
A10 21 _A10
A11 23 _A11
A12 2 _A12
A13 26 _A13
A14 1 _A14
GND 20 CE
RD ₁₇
WR 16
22 OE
27 _WR
PSEN
ALE
TXD
29
30
11
RXD ¹⁰
20256
PACKAGE DIMENSIONS
40-pin DIP
Figure B
40
E1
1
S
AA2
L
D
B
e1
B1
21
20
E
A1
Base Plane
Seating Plane
a
eA
Symbol
A
A1
A2
B
B¹
c
D
E
E1
e1
L
a
eA
S
Dimension in inches
Dimension in mm
Min. Nom. Max.
0.210
0.010
Min. Nom. Max.
5.334
0.254
0.150 0.155 0.160 3.81 3.937 4.064
0.016 0.018 0.022 0.406 0.457 0.559
0.048 0.050 0.054 1.219 1.27 1.372
0.008 0.010 0.014 0.203 0.254 0.356
2.055 2.070
52.20 52.58
0.590 0.600 0.610 14.986 15.24 15.494
0.540 0.545 0.550 13.72 13.84 13.97
0.090 0.100 0.110 2.286 2.54 2.794
0.120
0
0.130 0.140
15
3.048
0
3.302 3.556
15
0.630 0.650 0.670 16.00 16.51 17.01
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold. parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
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