W972GG8JB-3-TR Datasheet, PDF (86/87 Pages) Winbond – 32M 8 BANKS 8 BIT DDR2 SDRAM

W972GG8JB
12. PACKAGE SPECIFICATION
Package Outline WBGA60 (11x11.5 mm²)
A
bbb C
E
aaa
E1
A1
Pin A1 index
9 8 76 5 43 2 1
Pin A1 index
1 2 34 5 6 7 8 9
A
A
B
B
C
C
D
D
B
E
E
A
F
F
G
G
H
H
J
J
K
K
L
L
eE
The window-side
encapsulant
60xΦb
Solder ball diameter refers.
To post reflow condition.
ddd M C A B
eee M C
Dimension (mm)
Symbol
Min. Nom. Max.
A
---
--- 1.20
A1 0.25 --- 0.40
b
0.40 0.45 0.50
D 11.40 11.50 11.60
E 10.90 11.00 11.10
D1
8.00 BSC.
E1
6.40 BSC.
eE
0.80 BSC.
eD
0.80 BSC.
aaa
---
--- 0.15
bbb
---
--- 0.20
ccc
---
--- 0.10
ddd ---
--- 0.15
eee ---
--- 0.08
ccc C
B
C
Seating plane
Ball Land
Ball Opening
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
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Publication Release Date: Dec. 03, 2012
Revision A03