W989D6DB Datasheet, PDF (63/64 Pages) Winbond – Standard Self Refresh Mode

W989D6DB / W989D2DB
12.2 LPSDR x32
Package Outline VFBGA 90 Balls (8x13 mm², Ball pitch:0.8mm, Ø =0.45mm)
D1
e
–A–
D
PIN #1
aaa
–B–
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 23 4 5 6 7 8 9
Note: Dimensions apply to Solder Balls Post-Reflow.
The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad.
aaa
CAVITY
Symbol
A
A1
A2
D
E
D1
E1
e
b
aaa
bbb
ccc
Dimension in mm
MIN NOM MAX
---
--- 1.025
0.275 0.300 0.325
0.61 0.66 0.71
7.90 8.00 8.10
12.90 13.00 13.10
--- 6.40 ---
--- 11.20 ---
--- 0.80 ---
0.40 0.45 0.50
0.15
0.20
0.12
Dimension in inch
MIN NOM MAX
---
--- 0.040
0.011 0.012 0.013
0.024 0.026 0.028
0.311 0.315 0.319
0.508 0.512 0.516
--- 0.252 ---
--- 0.441 ---
--- 0.031 ---
0.016 0.018 0.020
0.006
0.008
0.005
// bbb C
–C–
ccc C
BALL LAND
SOLDER BALL
SEATING PLANE
BALL OPENING
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
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Publication Release Date: Mar. 19, 2014
Revision: A01-001