W989D6DB Datasheet, PDF (62/64 Pages) Winbond – Standard Self Refresh Mode

W989D6DB / W989D2DB
12. PACKAGE SPECIFICATION
12.1 LPSDR x16
Package Outline VFBGA 54 Balls (8x9 mm², Ball pitch:0.8mm, Ø =0.45mm)
D1
e
–A–
D
PIN #1
aaa
–B–
J
H
G
F
E
D
C
B
A
1 23 4 5 6 78 9
Note: Dimensions apply to Solder Balls Post-Reflow.
The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad.
aaa
CAVITY
Symbol
A
A1
A2
D
E
D1
E1
e
b
aaa
bbb
ccc
Dimension in mm
MIN NOM MAX
---
--- 1.025
0.275 0.300 0.325
0.61 0.66 0.71
7.90 8.00 8.10
8.90 9.00 9.10
--- 6.40 ---
--- 6.40 ---
--- 0.80 ---
0.40 0.45 0.50
0.15
0.20
0.12
Dimension in inch
MIN NOM MAX
---
--- 0.040
0.011 0.012 0.013
0.024 0.026 0.028
0.311 0.315 0.319
0.350 0.354 0.358
--- 0.252 ---
--- 0.252 ---
--- 0.031 ---
0.016 0.018 0.020
0.006
0.008
0.005
// bbb C
–C–
ccc C
BALL LAND
SOLDER BALL
SEATING PLANE
BALL OPENING
Note: 1. Ball land : 0.5mm
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
- 62 -
Publication Release Date: Mar. 19, 2014
Revision: A01-001