W949D6DB Datasheet, PDF (59/60 Pages) Winbond – Standard Self Refresh Mode

W949D6DB / W949D2DB
10.2 LPDDR x32
Package Outline VFBGA 90 Balls (8x13 mm², Ball pitch: 0.8mm, Ø =0.42mm)
D1
e
–A–
D
PIN #1
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
2
1 23 4 5 6 7 8 9
aaa
–B–
aaa
Symbol
A
A1
D
E
D1
E1
e
b
aaa
bbb
ccc
Dimension in mm
MIN NOM MAX
---
--- 1.025
0.270 0.320 0.370
7.90 8.00 8.10
12.90 13.00 13.10
--- 6.40 ---
--- 11.20 ---
--- 0.80 ---
0.40 0.45 0.50
0.15
0.20
0.12
Dimension in inch
MIN NOM MAX
---
--- 0.040
0.011 0.013 0.015
0.311 0.315 0.319
0.508 0.512 0.516
--- 0.252 ---
--- 0.441 ---
--- 0.031 ---
0.016 0.018 0.020
0.006
0.008
0.005
// bbb C
CAVITY
–C–
ccc C
BALL LAND
SOLDER BALL
SEATING PLANE
1
BALL OPENING
Note: 1. Ball land : 0.5mm. Ball opening : 0.4mm. PCB Ball land suggested ≤ 0.4mm
2. Dimensions apply to Solder Balls Post-Reflow. The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad
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Publication Release Date: Oct. 08, 2014
Revision: A01-003