ISD5116 Datasheet, PDF (56/57 Pages) Winbond – Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability

ISD 5116 SERIES BONDING PHYSICAL LAYOUT ⁽¹⁾ (UNPACKAGED DIE)
SDA ^{ADL SCL}
V_SSD ^{VS SD AD0}
V_CCD V_{CCD XCLK IN T}
RAC
V_{SS A}
ISD5116 Series
Die Dimensions
X: 4125 um
Y: 8030 um
Die Thickness⁽³⁾
292.1 um + 12.7 um
Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
ISD5116
V_{SS A}
MIC+
AUX OUT
MIC–
AUX IN
ANA IN
ANAOUT+
ANAOUT– ACAP
SP–
V
S
(2
SA
)
S
P+
V_CC
(2
A
)
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other
potential or damage may occur.
2.
Double bond recommended.
3.
This figure reflects the current die thickness. Please contact ISD as this thickness may change in
the future.
October 2000
Page 55