ISD5116 Datasheet, PDF (37/57 Pages) Winbond – Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability

6.3 POWER AND GROUND PINS
V_CCA, V_CCD (Voltage Inputs)
To minimize noise, the analog and digital circuits in the ISD5116 device use separate power busses.
These +3 V busses lead to separate pins. Tie the V_CCD pins together as close as possible and decouple
both supplies as near to the package as possible.
V_SSA, V_SSD (Ground Inputs)
The ISD5116 series utilizes separate analog and digital ground busses. The analog ground (V_SSA) pins
should be tied together as close to the package as possible and connected through a low-impedance
path to power supply ground. The digital ground (V_SSD) pin should be connected through a separate low
impedance path to power supply ground. These ground paths should be large enough to ensure that the
impedance between the V_SSA pins and the V_SSD pin is less than 3Ω. The backside of the die is connected
to V_SSD through the substrate resistance. In a chip-on-board design, the die attach area must be con-
nected to V_SSD.
NC (Not Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or V_CC, may result in incorrect device behavior or cause damage to the device.
6.4 SAMPLE PC LAYOUT
The SOIC package is illustrated from the top. PC board traces and the three chip capacitors are on the
bottom side of the board.
V
Note 1
Note 2
1_O
C1 _O
V
O
C2 O
C
C
O
O XCLK
D
O
O
Note 3
S
S
D
(Digital Ground)
O
O
O
O ^VSSA
O
O
O
O ^{C1=C2=C3=0.1 uF chip Capacitors}
Note 1: V_SSD traces should be kept
O
O
separated back to the V_SS supply feed ^O
O
point..
O
O
Note 2: V_CCD traces should be kept
O
separate back to the V_CC Supply feed ^O
point.
O
C3 _O
O
O
To
V_CCA
Note 3: The Digital and Analog grounds
tie together at the power supply. The
V_CCA and V_CCD supplies will also need
filter capacitors per good engineering
Analog Ground Note 3
practice (typ. 50 to 100 uF).
October 2000
Page 36