W741C260 Datasheet, PDF (37/92 Pages) Winbond – 4-BIT MICROCONTROLLER

W741C260
PAD ASSIGMENT & POSITIONS
2850 µm
3330 µm
69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54
1
53
2
52
3
51
4
5
Y
50
6
49
7
48
8
X
47
9
(0,0)
46
10
45
11
44
12
43
13
42
14
41
15
40
16
39
17
38
18
37
19
36
20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
Note: The chip substrate must be connected to system ground (VSS).
PAD NO.
1
2
3
4
5
6
7
8
9
10
PAD NAME
RE2
RE3
VSS
COM3
COM2
COM1
COM0
SEG0
SEG1
SEG2
X
-1227.00
-1227.00
-1227.00
-1227.00
-1227.00
-1227.00
-1227.00
-1227.00
-1227.00
-1227.00
Y
1122.00
992.00
862.00
732.00
602.00
472.00
342.00
212.00
82.00
-48.00
PAD NO.
11
12
13
14
15
16
17
18
19
20
PAD NAME
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
X
Y
-1227.00 -178.00
-1227.00 -308.00
-1227.00 -438.00
-1227.00 -568.00
-1227.00 -698.00
-1227.00 -828.00
-1227.00 -958.00
-1227.00 -1088.00
-1227.00 -1218.00
-975.00 -1468.00
- 37 -
Publication Release Date: March 1998
Revision A3