CC3220MOD_017 Datasheet, PDF (98/100 Pages) Texas Instruments – SimpleLink Wi-Fi CERTIFIED Wireless MCU Modules

MON0063A
EXAMPLE BOARD LAYOUT
QFM - 2.41 mm max height
QUAD FLAT MODULE
54X ( 0.8)
1
2
(45 X 1)
SOLDER MASK
OPENING
9X
PKG
(0.65)
TYP
(1.27) TYP
54
55
56
57
(0.65)
TYP
PATTERN
( 8.1)
0.05 MIN TYP
58
PKG
SEE DETAIL
44
43
42
9X ( 2)
( 0.2) TYP
VIA
59
60
61
62
6X (3)
(1.5)
63
(1.5)
METAL UNDER
SOLDER MASK
(19.048)
6X (3)
(20.5)
15
16
(R0.05)
ALL PADS
17
(8.05)
29
28
(3.724)
(25)
27
(4.326)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE:5X
NO TRACES, VIAS, GND PLANE
OR SILK SCREEN SHOULD BE
LOCATED WITHIN THIS AREA
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
EXPOSED METAL
METAL UNDER
SOLDER MASK
SIGNAL PADS DETAIL
4223415/A 03/2017
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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