BQ4050 Datasheet, PDF (8/53 Pages) Texas Instruments – CEDV Gas Gauge and Protection Solution

bq4050
SLUSC67A – MARCH 2016 – REVISED MARCH 2016
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6.3 Recommended Operating Conditions
Typical values stated where T_A = 25°C and VCC = 14.4 V, Min/Max values stated where T_A = –40°C to 85°C and VCC =
2.2 V to 26 V (unless otherwise noted)
MIN NOM
MAX UNIT
V_CC
V_{SHUTDOWN–}
V_SHUTDOWN+
V_HYS
Supply voltage
Shutdown voltage
Start-up voltage
Shutdown voltage
hysteresis
BAT, VCC, PBI
V_PACK < V_{SHUTDOWN–}
V_PACK > V_{SHUTDOWN–} + V_HYS
V_SHUTDOWN+ – V_{SHUTDOWN–}
2.2
1.8
2.0
2.05 2.25
250
26 V
2.2 V
2.45 V
mV
PACK, SMBC, SMBD, PRES, BTP_IN, DISP
26
TS1, TS2, TS3, TS4
V_REG
PTC, PTCEN, LEDCNTLA, LEDCNTLB, LEDCNTLC
V_BAT
SRP, SRN
V_IN
Input voltage range
VC4
–0.2
V_VC3
0.2
V
V_VC3 + 5
VC3
V_VC2
V_VC2 + 5
VC2
V_VC1
V_VC1 + 5
VC1
V_VSS
V_VSS + 5
V_O
Output voltage
range
CHG, DSG, PCHG, FUSE
26 V
C_PBI
External PBI
capacitor
2.2
µF
T_OPR
Operating
temperature
–40
85 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq4050
RSM (QFN)
UNIT
32 PINS
R_{θJA, High K}
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_{θJC(bottom)}
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
47.4
°C/W
40.3
°C/W
14.7
°C/W
0.8
°C/W
14.4
°C/W
3.8
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics: Supply Current
Typical values stated where T_A = 25°C and VCC = 14.4 V, Min/Max values stated where T_A = –40°C to 85°C and VCC =
2.2 V to 20 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
I_NORMAL
I_SLEEP
NORMAL mode
SLEEP mode
CHG on. DSG on, no Flash write
CHG off, DSG on, no SBS communication
CHG off, DSG off, no SBS communication
336
µA
75
µA
52
I_SHUTDOWN
SHUTDOWN mode
1.6
µA
8
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