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BQ4050 Datasheet, PDF (7/53 Pages) Texas Instruments – CEDV Gas Gauge and Protection Solution | |||
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bq4050
SLUSC67A â MARCH 2016 â REVISED MARCH 2016
10 Ω
VC4
1.9 MΩ
0.1 MΩ
CHANx
ADC Mux
ADC
10 Ω
PACK
1.9 MΩ
0.1 MΩ
VC4 and PACK Dividers
CHANx
ADC Mux
ADC
SRP
SRN
Φ2
3.8 kΩ
Φ1
Comparator
Φ2
3.8 kΩ
Array
Φ1
Φ2
100 Ω
Φ1
Φ2
100 Ω
Φ1
Coulomb
Counter
OCD, SCC, SCD Comparators and Coulomb Counter
Figure 3. Pin Equivalent Diagram 3
6 Specifications
6.1 Absolute Maximum Ratings
Over-operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply voltage range, VCC BAT, VCC, PBI
â0.3
PACK, SMBC, SMBD, PRES or SHUTDN, BTP_INT, DISP
â0.3
30
V
30
V
TS1, TS2, TS3, TS4
PTC, PTCEN, LEDCNTLA, LEDCNTLB, LEDCNTLC
SRP, SRN
â0.3
â0.3
â0.3
VREG + 0.3
V
VBAT + 0.3
V
0.3
V
Input voltage range, VIN
VC4
VC3
VC3 â 0.3
VC3 + 8.5 V, or
VSS + 30
V
VC2 â 0.3
VC2 + 8.5 V, or
VSS + 30
V
VC2
VC1 â 0.3
VC1 + 8.5 V, or
VSS + 30
V
VC1
VSS â 0.3
VSS + 8.5 V, or
VSS + 30 V
V
Output voltage range, VO
CHG, DSG
PCHG, FUSE
â0.3
32
â0.3
30
V
Maximum VSS current, ISS
TSTG
Storage temperature
Lead temperature (soldering, 10 s), TSOLDER
50
mA
â65
150
°C
300
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absoluteâmaximumârated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification
JESD22-C101 (2)
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
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