TLE202X_16 Datasheet, PDF (5/80 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
TLE2022Y chip information
This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(8)
80
(1)
(2)
86
(6)
V_CC+
(8)
IN + ⁽³⁾ ₊
(2)
IN −
−
(1)
OUT
(7)
+ ⁽⁵⁾ _{IN +}
OUT
(6)
−
IN −
(5)
(4)
(4)
V_{CC −}
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T_Jmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(3)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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