TLE202X_16 Datasheet, PDF (4/80 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
TLE2021Y chip information
This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
(5)
(1)
OFFSET N1
V_CC+
(7)
IN + ⁽³⁾ ₊
(2)
IN −
−
(6)
OUT
OFFSET N2
(5)
(4)
V_{CC −} /GND
78
(1)
(2)
54
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T_Jmax= 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(4)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(3)
4
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