TLE202X_16 Datasheet, PDF (2/80 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
TLE2021 AVAILABLE OPTIONS
T_A
V_IOmax
AT 25°C
SMALL
OUTLINE^†
(D)
SSOP^‡
(DB)
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP^‡
(PW)
CHIP
FORM^§
(Y)
0°C to
70°C
200 μV
500 μV
TLE2021ACD
TLE2021CD ^TLE2021CDBLE
—
TLE2021ACP
—
—
—
TLE2021CP TLE2021CPWLE TLE2021Y
− 40°C
to
85°C
200 μV
500 μV
TLE2021AID
TLE2021ID
—
—
—
TLE2021AIP
TLE2021IP
—
—
− 55°C
to
125°C
100 μV
500 μV
—
TLE2021MD
—
TLE2021BMFK TLE2021BMJG
—
TLE2021MFK TLE2021MJG TLE2021MP
—
—
† _{The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).}
‡ _{The DB and PW packages are only available left-end taped and reeled.}
§ _{Chip forms are tested at 25°C only.}
TLE2022 AVAILABLE OPTIONS
T_A
V_IOmax
AT 25°C
SMALL
OUTLINE^†
(D)
SSOP^‡
(DB)
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP^‡
(PW)
CHIP
FORM^§
(Y)
0°C 150 μV TLE2022BCD
—
to
300 μV TLE2022ACD
—
—
70°C 500 μV TLE2022CD _TLE2022CDBLE
—
—
—
—
TLE2022ACP
—
—
TLE2022CP TLE2022CPWLE TLE2022Y
−40°C 150 μV TLE2022BID
to
300 μV TLE2022AID
—
85°C 500 μV TLE2022ID
—
—
—
TLE2022AIP
—
—
TLE2022IP
−55°C 150 μV
—
—
TLE2022BMJG
—
to
300 μV TLE2022AMD
—
TLE2022AMFK TLE2022AMJG TLE2022AMP
—
—
125°C 500 μV TLE2022MD
TLE2022MFK TLE2022MJG TLE2022MP
† _{The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).}
‡ _{The DB and PW packages are only available left-end taped and reeled.}
§ _{Chip forms are tested at 25°C only.}
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
T_A
V_IOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
(DW)
(FK)
(J)
500 μV TLE2024BCDW
0°C to 70°C
750 μV TLE2024ACDW
—
—
1000 μV TLE2024CDW
500 μV TLE2024BIDW
−40°C to 85°C
750 μV TLE2024AIDW
—
—
1000 μV TLE2024IDW
−55°C to 125°C
500 μV TLE2024BMDW
750 μV TLE2024AMDW
1000 μV TLE2024MDW
§ _{Chip forms are tested at 25°C only.}
TLE2024BMFK
TLE2024AMFK
TLE2024MFK
TLE2024BMJ
TLE2024AMJ
TLE2024MJ
PLASTIC
DIP
(N)
TLE2024BCN
TLE2024ACN
TLE2024CN
TLE2024BIN
TLE2024AIN
TLE2024IN
TLE2024BMN
TLE2024AMN
TLE2024MN
CHIP
FORM^§
(Y)
—
—
TLE2024Y
—
—
2
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