SN74AUP1G80_17 Datasheet, PDF (5/38 Pages) Texas Instruments – Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

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Recommended Operating Conditions (continued)
See ⁽¹⁾
I_OL
Low-level output current⁽²⁾
Δt/Δv
T_A
Input transition rise or fall rate
Operating free-air temperature
V_CC = 0.8 V
V_CC = 1.1 V
V_CC = 1.4 V
V_CC = 1.65 V
V_CC = 2.3 V
V_CC = 3 V
V_CC = 0.8 V to 3.6 V
SN74AUP1G80
SCES593F – JULY 2004 – REVISED JULY 2017
MIN
MAX
UNIT
20
µA
1.1
1.7
1.9
mA
3.1
4
200
ns/V
–40
85
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
Junction-to-ambient
thermal resistance
R_θJC(top)
Junction-to-case (top)
thermal resistance
R_θJB
Junction-to-board
thermal resistance
Junction-to-top
ψ_JT
characterization
parameter
Junction-to-board
ψ_JB
characterization
parameter
Junction-to-case
R_θJC(bot) (bottom) thermal
resistance
DBV (SOT)
5 PINS
267.2
191.9
101.1
83.0
100.8
n/a
DCK (SC70) DRY (SON)
5 PINS
6 PINS
284.1
341.1
208.5
233.1
103.1
206.7
76.6
63.4
102.3
206.7
n/a
n/a
SN74AUP1G80
DSF (SON) YFP (DSBGA)
6 PINS
6 PINS
YZP (DSBGA)
5 PINS
DPW (X2SON)
5 PINS
377.1
125.4
146.2
489.2
187.7
1.9
1.4
226.3
236.6
37.2
39.3
352.9
29.0
0.5
0.7
38.2
236.3
37.5
39.8
352.1
n/a
n/a
n/a
150.8
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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