SN74AUP1G80_17 Datasheet, PDF (33/38 Pages) Texas Instruments – Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop

YFP0006
EXAMPLE STENCIL DESIGN
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
6X ( 0.25)
(0.4) TYP
1
2
A
(0.4) TYP
B
METAL
TYP
C
SYMM
(R0.05) TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:50X
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
4223410/A 11/2016
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