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TLC34075-135FN Datasheet, PDF (44/52 Pages) Texas Instruments – Video Interface Palette Data Manual
Appendix B
PC Board Layout Considerations
PC Board Considerations
A four-layer PC board should be used with the TLC34075: one layer each for 5-V power and GND and two
layers for signals. The layout should be optimized for the lowest-possible noise on the TLC34075 power and
ground lines by shielding the digital inputs and providing good decoupling. The lead length between groups
of VDD and GND pins should be minimized so as to reduce inductive ringing. The terminal assignments for
the TLC34075 P<0:31> inputs were selected for minimum interconnect lengths between these inputs and
the VRAM pixel data outputs. The TLC34075 should be located as close to the output connectors as
possible to minimize noise pickup and reflections due to impedance mismatching.
Ground Plane
A single ground plane is recommended for both the TLC34075 and the rest of the logic. Separate digital and
analog ground planes are not needed.
Power Plane
Split power planes are recommended for the TLC34075 and the rest of the logic. The TLC34075 and its
associated analog circuitry should have their own power plane (referred to as AVCC in Figure 18). The two
power planes should be connected at a single point through a ferrite bead as shown in Figures 18, 19, and
20. This bead should be located within three inches of the TLC34075.
Supply Decoupling
Bypass capacitors should be installed using the shortest leads possible, consistent with reliable operation,
to reduce the lead inductance.
For the best performance, a 0.1-µF ceramic capacitor in parallel with a 0.01-µF chip capacitor should be
used to decouple each of the three groups of power pins to GND. These capacitors should be placed as
close as possible to the device as shown in Figure 19.
If a switching power supply is used, the designer should pay close attention to reducing power supply noise
and should consider using a three-terminal voltage regulator for supplying power to AVCC.
COMP and VREF Terminals
A 100-Ω resistor and 0.1-µF ceramic capacitor (approximate values) should be connected in series
between the device’s COMP and VDD terminals in order to avoid noise and color-smearing problems. Also,
whether an internal or external voltage reference is used, a 0.1-µF capacitor should be connected between
the device’s VREF and GND terminals to further stabilize the video image. These resistor and capacitor
values may vary depending on the board layout; experimentation may be required in order to determine
optimum values.
B–1