DRV8850_16 Datasheet, PDF (4/30 Pages) Texas Instruments – Low-Voltage H-Bridge IC with LDO Voltage Regulator

DRV8850
SLVSCC0B – NOVEMBER 2013 – REVISED DECEMBER 2015
www.ti.com
NAME
OUTPUT
OUT1
OUT2
PIN
NO.
2, 3, 4
18, 19, 20
VPROPI
16
I/O ⁽¹⁾
Pin Functions (continued)
DESCRIPTION
EXTERNAL COMPONENTS OR CONNECTIONS
O
Output 1
O
Output 2
O
Current sense output
Connect to motor winding
Output current is proportional to H-bridge current. 1 kΩ, 1%
resistor to GND for 2-A maximum current with VCC at 2 V. See
Equation 1 if more current is required
Table 1. External Components
NAME
PIN
NO.
LDOFB
14
LDOOUT
SR
VCC
VCP
15
11
21, 22, 23
17
LDO regulator
feedback
LDO regulator output
Slew rate control
Device supply
Charge pump
VPROPI
16
Current sense output
DESCRIPTION
Resistor divider from LDOUT sets LDO output voltage.
Bypass to GND with a 2.2-μF 6.3-V ceramic capacitor.
Resistor to ground sets output slew rate GND to 2.4 MΩ.
Bypass to GND with 0.1-μF and 10-μF 6.3-V ceramic capacitors.
Connect a 0.1-μF 6.3-V ceramic capacitor to VCC
Output current is proportional to H-bridge current. 1 kΩ, 1% resistor to GND for 2-A
max current with VCC at 2 V. See Equation 1 for if more current is required.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
MIN
MAX
UNIT
Power supply voltage, VCC
–0.3
7
V
Charge pump, VCP
–0.3
VCC + 7
V
Digital pin voltage, LDOEN, IN1H, IN1L, IN2H, IN2L, nSLEEP
–0.5
7
V
Other pins, OUT1, OUT2, SR, LDOUT, LDOFB, VPROPI
–0.3
7
V
Peak motor drive output current, OUT1, OUT2
Internally Limited
A
LDO output current, LDOOUT
Internally Limited
A
T_J
Operating junction temperature
T_stg
Storage temperature
–40
150
°C
–60
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins⁽²⁾
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
4
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