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DRV8850_16 Datasheet, PDF (2/30 Pages) Texas Instruments – Low-Voltage H-Bridge IC with LDO Voltage Regulator
DRV8850
SLVSCC0B – NOVEMBER 2013 – REVISED DECEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ................................................ 7
6.7 Typical Characteristics .............................................. 8
7 Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 18
8 Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application ................................................. 19
9 Power Supply Recommendations...................... 21
9.1 Bulk Capacitance .................................................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
10.3 Thermal Considerations ........................................ 22
11 Device and Documentation Support ................. 23
11.1 Community Resources.......................................... 23
11.2 Trademarks ........................................................... 23
11.3 Electrostatic Discharge Caution ............................ 23
11.4 Glossary ................................................................ 23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (January 2014) to Revision B
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
• Removed HTSSOP package. ................................................................................................................................................ 1
Changes from Original (November 2013) to Revision A
Page
• Removed product preview banner.......................................................................................................................................... 1
2
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