MSP430FR5994 Datasheet, PDF (37/166 Pages) Texas Instruments – Mixed-Signal Microcontrollers

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MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54 – MARCH 2016
High-Frequency Crystal Oscillator, HFXT⁽¹⁾ (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
DC_HFXT
f_HFXT,SW
PARAMETER
HFXT oscillator duty cycle
HFXT oscillator logic-level
square-wave input frequency,
bypass mode
TEST CONDITIONS
Measured at SMCLK,
f_HFXT = 16 MHz
HFXTBYPASS = 1, HFFREQ = 0^{(4) (3)}
HFXTBYPASS = 1, HFFREQ = 1 ^{(4) (3)}
HFXTBYPASS = 1, HFFREQ = 2 ^{(4) (3)}
HFXTBYPASS = 1, HFFREQ = 3 ^{(4) (3)}
V_CC
MIN TYP MAX UNIT
40% 50% 60%
0.9
4.01
8.01
16.01
4
8
MHz
16
24
DC_{HFXT, SW}
HFXT oscillator logic-level
square-wave input duty cycle
HFXTBYPASS = 1
40%
60%
OA_HFXT
Oscillation allowance for
HFXT crystals⁽⁵⁾
t_START,HFXT Start-up time⁽⁶⁾
C_HFXIN
Integrated load capacitance at
HFXIN terminal^{(7) (8)}
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1⁽²⁾
f_HFXT,HF = 4 MHz, C_L,eff = 16 pF
HFXTBYPASS = 0, HFXTDRIVE = 1,
HFFREQ = 1
f_HFXT,HF = 8 MHz, C_L,eff = 16 pF
HFXTBYPASS = 0, HFXTDRIVE = 2,
HFFREQ = 2
f_HFXT,HF = 16 MHz, C_L,eff = 16 pF
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3
f_HFXT,HF = 24 MHz, C_L,eff = 16 pF
f_OSC = 4 MHz
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1, T_A = 25°C, C_L,eff = 16 pF
f_OSC = 24 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3, T_A = 25°C, C_L,eff = 16 pF
3.0 V
450
Ω
320
Ω
200
Ω
200
Ω
1.6
ms
0.6
2
pF
C_HFXOUT
f_Fault,HFXT
Integrated load capacitance at
HFXOUT terminal^{(7) (8)}
Oscillator fault frequency^{(9) (10)}
2
pF
0
800 kHz
(4) When HFXTBYPASS is set, HFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics
defined in the Schmitt-trigger Inputs section of this data sheet. Duty cycle requirements are defined by DC_{HFXT, SW}.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes start-up counter of 1024 clock cycles.
(7) This represents all the parasitic capacitance present at the HFXIN and HFXOUT terminals, respectively, including parasitic bond and
package capacitance. The effective load capacitance, C_L,eff can be computed as C_IN x C_OUT / (C_IN + C_OUT), where C_IN and C_OUT is the
total capacitance at the HFXIN and HFXOUT terminals, respectively.
(8) Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended
effective load capacitance values supported are 14 pF, 16 pF, and 18 pF. Maximum shunt capacitance of 7 pF. The PCB adds
additional capacitance, so it must also be considered in the overall capacitance. Verify that the recommended effective load capacitance
of the selected crystal is met.
(9) Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX might set the flag. A static
condition or stuck at fault condition sets the flag.
(10) Measured with logic-level input frequency but also applies to operation with crystals.
Copyright © 2016, Texas Instruments Incorporated
Specifications
37
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