DS90UA101-Q1_14 Datasheet, PDF (35/41 Pages) Texas Instruments – Multi-Channel Digital Audio Link

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DS90UA101-Q1
SNLS441A – JULY 2013 – REVISED SEPTEMBER 2013
VDDIO
C3
C8
Digital
Audio
Interface
DS90UA101-Q1
1.8V
VDDIO
VDDT
C4
C9
C13
1.8V
SCK
LRCK
BCK
DIN0
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
VDDPLL
C5 C10
C14
VDDCML
C6 C11 C15
VDDD
C7 C12
FB1
1.8V
FB2 _1.8V
C1
DOUT+
DOUT-
C2
Serial
Interface
PDB
1.8V
GPI
Interface
GPI0
GPI1
GPI2
GPI3
10 k3
IDx
1.8V
RID
GPO
Interface
I²C
Bus
Interface
VDDIO
GPO0
GPO1
GPO2
GPO3
RPU
RPU
SCL
SDA
SET
RES0
DAP (GND)
10k3
100k3
NOTE:
C1, C2 = 0.1 µF (50 WV)
C3 ± C7 = 0.01 µF
C8 - C12 = 0.1 µF
C13 - C14 = 4.7 µF
C15 = 22 µF
RPU = 4.7 k3
RID (see IDx Resistor Value Table)
FB1, FB2: Impedance = 1 k3 (@ 100 MHz)
low DC resistance (<13)
Figure 33. DS90UA101-Q1 Typical Connection Diagram (STP Interconnect)
PCB Layout and Power System Considerations
Circuit board layout and stack-up for the Ser/Des devices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by
using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2 µF to 10 µF range. Voltage rating of the
tantalum capacitors should be at least 5X the power supply voltage being used.
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50 µF to 100 µF range and will smooth low frequency switching noise. It is
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor will increase the inductance of the path.
Copyright © 2013, Texas Instruments Incorporated
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