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MSP430G2333-Q1 Datasheet, PDF (3/62 Pages) Texas Instruments – Automotive Mixed-Signal Microcontroller
www.ti.com
MSP430G2333-Q1
SLAS802A – OCTOBER 2013 – REVISED MARCH 2014
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Functional Block Diagram .................................... 2
5 Revision History..................................................... 4
6 Device Characteristics .......................................... 4
7 Terminal Configuration and Functions................ 5
7.1 20-Pin PW Package (Top View) ............................... 5
7.2 28-Pin PW Package (Top View) ............................... 5
7.3 Terminal Functions.................................................... 6
8 Detailed Description .............................................. 8
8.1 CPU........................................................................... 8
8.2 Instruction Set ........................................................... 8
8.3 Operating Modes....................................................... 9
8.4 Interrupt Vector Addresses ..................................... 10
8.5 Special Function Registers (SFRs)......................... 11
8.6 Memory Organization.............................................. 12
8.7 Bootstrap Loader (BSL) .......................................... 12
8.8 Flash Memory ......................................................... 12
8.9 Peripherals .............................................................. 13
9 Specifications....................................................... 18
9.1 Absolute Maximum Ratings ................................... 18
9.2 Recommended Operating Conditions..................... 18
9.3 Active Mode Supply Current Into VCC Excluding
External Current....................................................... 19
9.4 Typical Characteristics, Active Mode Supply Current
(Into VCC) ................................................................. 19
9.5 Low-Power Mode Supply Currents (Into VCC)
Excluding External Current ...................................... 20
9.6 Typical Characteristics, Low-Power Mode Supply
Currents ................................................................... 20
9.7 Schmitt-Trigger Inputs, Ports Px ............................. 21
9.8 Leakage Current, Ports Px...................................... 21
9.9 Outputs, Ports Px .................................................... 21
9.10 Output Frequency, Ports Px.................................. 21
9.11 Typical Characteristics, Outputs ........................... 22
9.12 Pin-Oscillator Frequency – Ports Px ..................... 23
9.13 Typical Characteristics, Pin-Oscillator Frequency 23
9.14 POR, BOR............................................................. 24
9.15 Main DCO Characteristics .................................... 26
9.16 DCO Frequency .................................................... 26
9.17 Calibrated DCO Frequencies, Tolerance.............. 27
9.18 Wakeup From Lower-Power Modes (LPM3, LPM4)
................................................................................. 28
9.19 Typical Characteristics, DCO Clock Wakeup Time
From LPM3 or LPM4................................................ 28
9.20 Crystal Oscillator, XT1, Low-Frequency Mode .... 29
9.21 Internal Very-Low-Power Low-Frequency Oscillator
(VLO)........................................................................ 29
9.22 Timer_A................................................................. 29
9.23 USCI (UART Mode) .............................................. 30
9.24 USCI (SPI Master Mode) ...................................... 30
9.25 USCI (SPI Slave Mode) ........................................ 31
9.26 USCI (I2C Mode) ................................................... 32
9.27 10-Bit ADC, Power Supply and Input Range
Conditions ................................................................ 33
9.28 10-Bit ADC, Built-In Voltage Reference ................ 34
9.29 10-Bit ADC, External Reference ........................... 35
9.30 10-Bit ADC, Timing Parameters............................ 35
9.31 10-Bit ADC, Linearity Parameters......................... 35
9.32 10-Bit ADC, Temperature Sensor and Built-In
VMID.......................................................................... 36
9.33 Flash Memory ....................................................... 36
9.34 RAM ...................................................................... 37
9.35 JTAG and Spy-Bi-Wire Interface........................... 37
9.36 JTAG Fuse ............................................................ 37
10 I/O Port Schematics ............................................ 38
10.1 Port P1 Pin Schematic: P1.0 to P1.2, Input/Output
With Schmitt Trigger ................................................ 38
10.2 Port P1 Pin Schematic: P1.3, Input/Output With
Schmitt Trigger......................................................... 40
10.3 Port P1 Pin Schematic: P1.4, Input/Output With
Schmitt Trigger......................................................... 42
10.4 Port P1 Pin Schematic: P1.5 to P1.7, Input/Output
With Schmitt Trigger ................................................ 44
10.5 Port P2 Pin Schematic: P2.0 to P2.5, Input/Output
With Schmitt Trigger ................................................ 46
10.6 Port P2 Pin Schematic: P2.6, Input/Output With
Schmitt Trigger......................................................... 48
10.7 Port P2 Pin Schematic: P2.7, Input/Output With
Schmitt Trigger......................................................... 50
11 Device and Documentation Support ................. 52
11.1 Device Support...................................................... 52
11.2 Documentation Support ........................................ 54
11.3 Community Resources.......................................... 54
11.4 Trademarks ........................................................... 55
11.5 Electrostatic Discharge Caution ............................ 55
11.6 Glossary ................................................................ 55
12 Mechanical, Packaging, and Orderable
Information ........................................................... 55
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