BQ24157 Datasheet, PDF (4/39 Pages) Texas Instruments – Fully Integrated Switch-Mode Charger With USB Compliance and USB-OTG Support

bq24157
SLUSB80 – SEPTEMBER 2012
www.ti.com
ABSOLUTE MAXIMUM RATINGS^{(1) (2)}
over operating free-air temperature range (unless otherwise noted)
Supply voltage range (with respect to PGND⁽³⁾)
Input voltage range (with respect to PGND⁽³⁾)
VBUS; V_PMID ≥ V_BUS –0.3 V
SCL, SDA, OTG, SLRST, CSIN, CSOUT,
CD
bq24157
–2 to 20
–0.3 to 7
UNIT
V
V
Output voltage range (with respect to PGND⁽³⁾)
PMID, STAT
VREF
–0.3 to 20
V
7
V
SW, BOOT
–0.7 to 20
V
Voltage difference between CSIN and CSOUT inputs (V_(CSIN) – V_(CSOUT) )
Voltage difference between BOOT and SW inputs (V_(BOOT) – V_(SW) )
Voltage difference between VBUS and PMID inputs (V_(VBUS) – V_(PMID) )
Voltage difference between PMID and SW inputs (V_(PMID) – V_(SW) )
Output sink
STAT
Output Current (average)
SW
±7
V
-0.3 to 7
V
-7 to 0.7
V
-0.7 to 20
V
10
mA
1.55 ⁽²⁾
A
T_A Operating free-air temperature range
T_J Junction temperature
T_stg Storage temperature
–30 to 85
°C
–40 to 125
°C
–45 to 150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Duty cycle for output current should be less than 50% for 10- year life time when output current is above 1.25A.
(3) All voltages are with respect to PGND if not specified. Currents are positive into, negative out of the specified terminal, if not specified.
Consult Packaging Section of the data sheet for thermal limitations and considerations of packages.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
bq24157
YFF (20 PINS)
85
25
55
4
50
n/a
UNITS
°C/W
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(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
V_BUS
T_J
Supply voltage, bq24157
Operating junction temperature range
MIN NOM MAX UNIT
4
6 ⁽¹⁾
V
–40
125 °C
(1) The inherent switching noise voltage spikes should not exceed the absolute maximum rating on either the BOOST or SW pins. A tight
layout minimizes switching noise.
4
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