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| CC2564_15 Datasheet, PDF (38/47 Pages) Texas Instruments – Bluetooth® and Dual-Mode Controller | |||
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CC256x
SWRS121D â JULY 2012 â REVISED JANUARY 2014
6 mrQFN Mechanical Data
RVM (S-PVQFN-N76)
www.ti.com
PLASTIC QUAD FLATPACK NO-LEAD
8,10
7,90
SQ
7,83
7,63 SQ
Pin 1 Indentifier
0,90
0,80
0,08 C
0,30 TYP
4X 5,40
4X 4,80
0,65
0,55
Seating Plane
0,05
0,00
CL â
PKG.
CL â
PAD
0,60
4X 0,24
4X 0,60
0,24
THERMAL PAD
SIZE AND SHAPE
SHOWN ON SEPARATE SHEET
4X 0,70
0,17
0,60
0,25
76X 0,15
0,10
CAB
0,50
76X 0,30
0,10
CAB
NOTES:
Bottom View
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5-1994.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No-Lead) Package configuration.
D. The package thermal pad must be soldered to the board for thermal and mechanical performance.
E. See the additional figure in the Product Data Sheet for details regarding the exposed thermal pad features and dimensions.
4211965/B 12/11
SWRS115-001
38
mrQFN Mechanical Data
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Copyright © 2012â2014, Texas Instruments Incorporated
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