CC2564_15 Datasheet, PDF (3/47 Pages) Texas Instruments – Bluetooth® and Dual-Mode Controller

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1.4 Functional Block Diagram
Figure 1-1 shows the device block diagram.
CC256x
PCM/I2S
I/O
interface
Coprocessor
(See Note)
BR/EDR
main processor
Modem
arbitrator
CC256x
SWRS121D – JULY 2012 – REVISED JANUARY 2014
DRP
2.4-GHz
band pass filter
RF
UART
HCI
Power
management
Clock
management
Note: The following technologies and assisted modes cannot
be used simultaneously with the coprocessor: LE, ANT, assisted
HFP 1.6 (WBS), and assisted A2DP. One and only one
technology or assisted mode can be used at a time.
Power Shutdown Slow
clock
Fast
clock
Figure 1-1. Functional Block Diagram
SWRS121-001
1 Bluetooth and Dual-Mode Controller ............... 1
1.1 Features ............................................. 1
1.2 Applications .......................................... 2
1.3 Description ........................................... 2
1.4 Functional Block Diagram ........................... 3
Revision History .............................................. 4
2 Bluetooth ................................................. 5
2.1 BR/EDR Features .................................... 5
2.2 LE Features .......................................... 5
2.3 Changes from CC2560A and CC2564 to CC2560B
and CC2564B Devices .............................. 6
2.4 Transport Layers ..................................... 6
3 Detailed Description .................................... 7
3.1 Pin Designation ...................................... 7
3.2 Terminal Functions .................................. 8
3.3 Device Power Supply ............................... 10
3.4 Clock Inputs ........................................ 12
3.5 Functional Blocks ................................... 15
4 Device Specifications ................................. 27
4.1 General Device Requirements and Operation ..... 27
4.2 Bluetooth BR/EDR RF Performance ............... 31
4.3 Bluetooth LE RF Performance ..................... 33
4.4 Interface Specifications ............................. 34
5 Reference Design and BOM for Power and Radio
Connections ............................................ 37
6 mrQFN Mechanical Data ............................. 38
7 Chip Packaging and Ordering ...................... 40
7.1 Package and Ordering Information ................. 40
7.2 Empty Tape Portion ................................ 41
7.3 Device Quantity and Direction ...................... 41
7.4 Insertion of Device ................................. 41
7.5 Tape Specification .................................. 42
7.6 Reel Specification .................................. 42
7.7 Packing Method .................................... 42
7.8 Packing Specification ............................... 43
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