AM1806_101 Datasheet, PDF (238/243 Pages) Texas Instruments – ARM Microprocessor

AM1806
SPRS658B – FEBRUARY 2010 – REVISED MAY 2010
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8.2 Thermal Data for ZCE Package
The following table(s) show the thermal resistance characteristics for the PBGA–ZCE mechanical
package.
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]
NO.
1
RΘ_JC
2
RΘ_JB
3
RΘ_JA
4
5
6
RΘ_JMA
7
8
9
10 Psi_JT
11
12
13
14
15 Psi_JB
16
17
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
°C/W ⁽¹⁾
7.6
11.3
23.9
21.2
20.3
19.5
18.6
0.2
0.3
0.3
0.4
0.5
11.2
11.1
11.1
11.0
10.9
AIR FLOW (m/s)⁽²⁾
N/A
N /A
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness
and 1.5oz (50um) inner copper thickness
(2) m/s = meters per second
238 Mechanical Packaging and Orderable Information
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