TLK2711-SP Datasheet, PDF (15/21 Pages) Texas Instruments – 1.6-Gbps to 2.5-Gbps Class V Transceiver

TLK2711-SP
www.ti.com .............................................................................................................................................................. SGLS307D – JULY 2006 – REVISED JULY 2009
VTXN
V_(cmt)
VTXP
V_OD(p)
V_OD(d)
Bit
Time
Bit
Time
Figure 10. Common-Mode Output Voltage Definitions
THERMAL INFORMATION
Thermal Characteristics
R_θJA
R_θJC
PARAMETER
Junction-to-free-air thermal resistance
Junction-to-case thermal resistance
TEST CONDITIONS
Board mounted, per JESD 51-5 methodology
MIL-STD-883 Test Method 1012
TYP UNIT
31.5 °C/W
2.96 °C/W
Thermal notes: This CQFP package has built in vias that electrically and thermally connect the bottom of the die
to a pad on the bottom of the package. In order to efficiently remove heat and provide a low-impedance ground
path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During
normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this
thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias
within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for
more efficient heat removal. TI typically recommends an 11,9-mm x 11.9-mm board-mount thermal pad with a
4,2-mm x 4,2-mm solder mask defined pad attach opening. This allows maximum area for thermal dissipation,
while allowing leads pad to solder pad clearance. A sufficient quantity of thermal/electrical vias must be included
to keep the device within recommended operating conditions. This pad must be electrically ground potential.
Copyright © 2006–2009, Texas Instruments Incorporated
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