STCOM Datasheet, PDF (56/58 Pages) STMicroelectronics – Powerline communication and application system-on-chip

Package information
STCOM
Table 33. TQFP176 (20 x 20 x 1 mm) package mechanical data
Symbol
Min.
Dimensions (millimeters)
Typ.
A
A1
0.05
A2
0.95
1.00
b
0.13
0.18
c
0.09
D
21.80
22.00
D1
19.80
20.00
D2
8.70
D3
17.20
E
21.80
22.00
E1
19.80
20.00
E2
8.70
E3
17.20
e
0.40
L
0.45
0.60
L1
1.00
k
0°
3.5°
ccc
Max.
1.20
0.127
1.05
0.23
0.20
22.20
20.20
22.20
20.20
0.75
7°
0.08
5.2
Thermal data
Table 34. Thermal data
Symbol
Parameter
Conditions
R_thJA
Maximum thermal resistance junction
ambient steady state
Mounted on a 2s2p PCB, with a dissipating
surface, connected through vias, on the bottom
side of the PCB.
Typ.
value
Unit
34 °C/W
56/58
DocID028515 Rev 1