S29NS-J Datasheet, PDF (74/85 Pages) SPANSION – 110 nm CMOS 1.8-Volt only Simultaneous Read/Write, Burst Mode Flash Memories

Data Sheet
S29NS064J
VDD044—44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 9.2 x
8 mm Package
A1 CORNER
INDEX MARK
D
A
D1
A1 CO
10
10 9 8 7 6 5 4 3 2 1
NF2
NF1
e
E
1.00
NF4
A
B
C
D
NF3
SE
7
A
A1
TOP VIEW
B
A2
SIDE VIEW
SEATING PLANE C
0.10 C
0.08 C
1.00
SD ₇
φb ₆
φ 0.15 M C A B
φ 0.05 M C
BOTTOM VIEW
PACKAGE
JEDEC
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
N
φb
e
SD / SE
VDD 044
N/A
8.00 mm x 9.20 mm NOM
PACKAGE
MIN
NOM
MAX
0.86
---
1.00
0.20
---
---
0.66
0.71
0.76
7.90
8.00
8.10
9.10
9.20
9.30
4.50
1.50
10
4
44
0.25
0.30
0.35
0.50
0.25
NOTE
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-199
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EX
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULAT
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR IN
MARK, METALLIZED MARK INDENTATION OR OTHER MEAN
Note: For reference only. BSC is an ANSI standard for Basic Space Centering.
3239 \ 16-038
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S29NS-J
S29NS-J_00_A10 March 22, 2006