S29NS-J Datasheet, PDF (73/85 Pages) SPANSION – 110 nm CMOS 1.8-Volt only Simultaneous Read/Write, Burst Mode Flash Memories

Data Sheet
Physical Dimensions
S29NS128J
A1 CORNER
INDEX MARK
10
VDC048—48-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 10 x 11 mm
Package
D
A
D1
A1 CORNER
10 9 8 7 6 5 4 3 2 1
NF2
NF1
NF3
e
E
1.00
1.00
NF5
NF7
NF4
A
B
C
D
NF6
NF8
SE ^E1
7
A
A1
SEATING PLANE
B
A2
0.10 C
C
0.08 C
1.00 1.00
φb 6
SD ₇
φ 0.15 M C A B
φ 0.05 M C
PACKAGE
JEDEC
VDC 048
N/A
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
N
φb
e
SD / SE
9.95 mm x 10.95 mm NOM
PACKAGE
MIN
NOM
MAX
0.86
---
1.00
0.20
---
---
0.66
0.71
0.76
9.85
9.95
10.05
10.85
10.95
11.05
4.50
1.50
10
4
48
0.25
0.30
0.35
0.50
0.25
NOTE
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
Note: For reference only. BSC is an ANSI standard for Basic Space Centering.
3241 \ 16-038.9h.aa01
March 22, 2006 S29NS-J_00_A10
S29NS-J
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