K4S640832N Datasheet, PDF (9/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
60Ball FBGA (For DDR 64Mb N-die)
#A1
8.0 0 ± 0.10
TOP VIEW
(Datum A)
(Datum B)
8.00 ± 0.10
0.80 x 8 = 6.40
0.80
1.60
987654321
A
B
C
D
E
F
G
H
J
K
L
M
Units : Millimeters
A
#A1 MARK
B
0.32 ± 0.05
1.10 ± 0.10
60 - ∅ 0.45 SOLDER BALL
(Post Reflow 0.50 ± 0.05)
∅0.20 M A B
BOTTOM VIEW
60Ball FBGA (For DDR 512Mb F-die, 512Mb G-die)
9.00 ± 0.10
#A1
WINDOW MOLD AREA
A
B
(Datum B) ^C
D
E
F
G
H
J
K
L
M
9.00 ± 0.10
0.80 x8 = 6.40
0.80 x4 = 3.20
0.80 x2= 1.60 0.80 x2 = 1.60
9 8 76543 2 1
Units : Millimeters
A
#A1 MARK(option)
B
0.80
TOP VIEW
1.20 MAX
60-∅0.45 ± 0.05 ^(0.90)
(0.90)
0.20 M A B
(1.80)
4-CORNER MARK(option)
(Datum A)
BOTTOM VIEW
-9-