K4S640832N Datasheet, PDF (10/15 Pages) Samsung semiconductor – Consumer Memory

Product Guide
Apr. 2010
Consumer Memory
60Ball FBGA (For DDR2 x8)
7.50 ± 0.10
#A1
TOP VIEW
MOLDING AREA
(Datum A)
(Datum B) A
B
C
D
E
F
G
H
J
K
L
7.50 ± 0.10
0.80 x 8 = 6.40
0.80
1.60
987654321
0.35±0.05
1.10±0.10
60-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
(0.95)
(1.90)
BOTTOM VIEW
Units : Millimeters
# A1 INDEX MARK
A
B
84Ball FBGA (For DDR2 128Mb O-die/256Mb N-die/512Mb G-die, I-die/1Gb E-die)
Units : Millimeters
7.50 ± 0.10
#A1
TOP VIEW
MOLDING AREA
(Datum A)
A
B
(Datum B) ^C
D
E
F
G
H
J
K
L
M
N
P
R
0.35±0.05
1.10±0.10
7.50 ± 0.10
0.80 x 8 = 6.40
3.20
0.80
1.60
987654321
A
# A1 INDEX MARK
B
(0.95)
(1.90)
BOTTOM VIEW
84-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M A B
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